Electronics Cleaning Products

Electronics Cleaning Products For over 25 years, Vantage has manufactured and supplied cleaning products to the electronics industry. Marketed under the AXAREL®, BIOACT®, HYDREX®, and LENIUM® brands, these products have been specially formulated to meet today’s performance, compatibility and environmental requirements.

Vantage electronics cleaning products are used in the following areas:

  • Military and avionics circuit assemblies
  • Wafer level packages and bumped wafers
  • Components – passive and active
  • Ceramic and hybrid circuit assemblies
  • Power and ignition modules
  • Microelectromechanical systems (MEMs)
  • RF and microwave devices
  • Flip chip packages
  • Wire bonded devices
  • Sensors – pressure, temperature, optical
  • Medical devices
  • Probe Cards

Vantage’s inline defluxing products are designed for optimal performance and lowest total cost of ownership. These products are recommended for removing the flux residues generated from today’s lead-free, no-clean and high temperature solder materials. Their outstanding cleaning power, high flux loading capacity, and low environmental impact make them ideal for cleaning assemblies, components, and microcircuits.

Product

Features

BIOACT EC-88

High Performance Inline Defluxer

  • Synergistic formulation combining the benefits of semi-aqueous and traditional aqueous defluxers.
  • Designed for high throughput and exceptionally long bath life.
  • Requires no anti-foaming agents or other additives to maintain performance.
  • Superior residue removal while protecting surface finishes and maximizing surface insulation resistance.

Vantage’s aqueous batch defluxing products are designed for use in spray, immersion and ultrasonic cleaning processes. These concentrated formulations are designed to be diluted with water prior to use. They effectively remove flux residues generated from today’s lead-free, no-clean and high temperature solder materials.

Product

Features

BIOACT EMC-86US

An electronics maintenance cleaning (EMC) solution designed to clean wave solder

pallets in soak, agitated immersion and ultrasonic cleaning systems.

BIOACT EC-78

Formulation combining the benefits of semi-aqueous, traditional aqueous defluxers

and advanced corrosion inhibition.

BIOACT EC-98

Ultrasonic defluxer formulated for optimal cleaning and energy utilization.

Designed for use over a broad temperature range

HYDREX SP-50

Neutral pH formulation designed for use in spray-in-air cleaning processes.

Also suitable for stencil and misprint cleaning.

HYDREX A-PLUS

Neutral pH formulation designed for use in ultrasonic cleaning processes.

Also suitable for stencil and misprint cleaning.

Vantage’s semi-aqueous defluxing products are designed to offer the longest bath life in the marketplace. Many of these products can be used with in zero discharge processes.

Product

Features

BIOACT EC-7R™

Bio-based defluxer designed for use at ambient temperature.

Readily separates from water allowing close loop water recycling and zero discharge.

AXAREL 32

Defluxer designed for use at elevated temperatures (140-160˚F / 60-71˚C).

Readily separates from water allowing close loop water recycling and zero discharge.

Vantage has been a leader in the movement away from highly flammable and/or toxic solvents since the early 1980’s. These products are suitable alternatives to isopropyl alcohol.

Product

Features

BIOACT EC-7M

Bio-based cleaner that is extremely effective on hard-to-remove residues.

BIOACT SC-10

Fast evaporating cleaner that eliminates white residues.

AXAREL 2200

Terpene-free, fast drying solvent with excellent solvency and low surface residues.

Vantage high-performance solvent cleaner designed to operate in open-top and vacuum vapor degreasers. This proprietary cleaner is a mixture based on n-propyl bromide (nPB), isopropyl alcohol (IPA) and stabilizers.

Product

Features

LENIUM ES

Effective in electronics defluxing applications, removing solder fluxes, pastes and ionic residues from circuit assemblies. It also effectively removes adhesives, buffing compounds, drawing oils, greases, hydraulic oils, lapping compounds, resins, inks, silicone oils and high melting waxes.

LENIUM GS

Effectively removes adhesives, buffing compounds, drawing oils, fluxes, pastes, greases, hydraulic oils, lapping compounds, resins, inks, silicone oils and high melting waxes.

LENIUM GS leaves low surface residue and is safe for use with ferrous and non-ferrous alloy.